17630676. MICRO-WAVE TRANSDUCER AND MANUFACTURING METHOD THEREOF simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
MICRO-WAVE TRANSDUCER AND MANUFACTURING METHOD THEREOF
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
Dongdong Zhang of Beijing (CN)
MICRO-WAVE TRANSDUCER AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17630676 titled 'MICRO-WAVE TRANSDUCER AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a micro-wave transducer and its manufacturing method in the field of communication.
- The micro-wave transducer consists of a dielectric layer with two opposite surfaces.
- A first electrode layer is placed on the first surface of the dielectric layer, with at least one opening.
- A transducer electrode is positioned on the second surface of the dielectric layer, with its projection within the projection of the opening on the dielectric layer.
- A first microstrip line is arranged on the second surface of the dielectric layer to feed the transducer electrode.
Potential applications of this technology:
- Communication systems
- Wireless devices
- Radar systems
- Satellite communication
Problems solved by this technology:
- Improved efficiency of micro-wave transducers
- Enhanced communication performance
- Reduction in signal loss
Benefits of this technology:
- Simplified manufacturing process
- Compact design
- Improved signal transmission
- Cost-effective production
Original Abstract Submitted
The disclosure provides a micro-wave transducer and a manufacturing method thereof, and belongs to the technical field of communication. The micro-wave transducer includes: a dielectric layer having a first surface and a second surface oppositely arranged; a first electrode layer arranged on the first surface of the dielectric layer, and the reference electrode layer being provided with at least one first opening; at least one transducer electrode arranged on the second surface of the dielectric layer, wherein an orthographic projection of one transducer electrode on the dielectric layer is within an orthographic projection of one first opening on the dielectric layer; at least one first microstrip line arranged on the second surface of the dielectric layer, wherein one first microstrip line is configured to feed one transducer electrode.
