17630670. BEARING SUBSTRATE, BINDING ASSEMBLY AND BINDING METHOD THEREOF simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

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BEARING SUBSTRATE, BINDING ASSEMBLY AND BINDING METHOD THEREOF

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Zhan Gao of Beijing (CN)

Xing Zhang of Beijing (CN)

Pan Xu of Beijing (CN)

Wei Liu of Beijing (CN)

Ying Han of Beijing (CN)

Guoying Wang of Beijing (CN)

Yicheng Lin of Beijing (CN)

Tangxiang Wang of Beijing (CN)

BEARING SUBSTRATE, BINDING ASSEMBLY AND BINDING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17630670 titled 'BEARING SUBSTRATE, BINDING ASSEMBLY AND BINDING METHOD THEREOF

Simplified Explanation

The present disclosure is about a bearing substrate, a binding assembly, and a binding method for displays. The bearing substrate is designed to be bound to an integrated substrate, with a higher thermal expansion coefficient than the integrated substrate. The integrated substrate has multiple second binding terminals evenly distributed in the same direction. The bearing substrate has multiple sets of first binding terminals evenly distributed in a first direction, and each set of first binding terminals is used to bind with the corresponding second binding terminals one-to-one.

  • The bearing substrate is designed to be bound to an integrated substrate.
  • The bearing substrate has a higher thermal expansion coefficient than the integrated substrate.
  • The integrated substrate has multiple second binding terminals evenly distributed in the same direction.
  • The bearing substrate has multiple sets of first binding terminals evenly distributed in a first direction.
  • Each set of first binding terminals is used to bind with the corresponding second binding terminals one-to-one.

Potential Applications

  • This technology can be applied in the field of display manufacturing.
  • It can be used in the production of various types of displays, such as LCDs or OLEDs.

Problems Solved

  • The technology solves the problem of binding a bearing substrate to an integrated substrate with different thermal expansion coefficients.
  • It provides a method for securely and accurately binding the two substrates together.

Benefits

  • The higher thermal expansion coefficient of the bearing substrate ensures a secure and stable binding with the integrated substrate.
  • The evenly distributed binding terminals allow for precise and efficient binding between the two substrates.
  • The binding method provides a reliable connection that can withstand thermal expansion and contraction.


Original Abstract Submitted

The present disclosure relates to the technical field of display, and provides a bearing substrate, a binding assembly, and a binding method thereof. The bearing substrate may be bound to an integrated substrate. A thermal expansion coefficient of the bearing substrate is greater than a thermal expansion coefficient of the integrated substrate. The integrated substrate includes a plurality of second binding terminals distributed at equal intervals in a same direction. The bearing substrate includes a plurality of first binding terminal sets distributed at equal intervals in a first direction, and each of the first binding terminal sets includes a plurality of first binding terminals distributed at equal intervals in the first direction for binding with the plurality of the second binding terminals one-to-one.

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