17621290. ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)

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ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

Organization Name

TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor(s)

Qian Liu of Shenzhen, Guangdong (CN)

ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17621290 titled 'ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The abstract describes an array substrate and a method of manufacturing the same. The array substrate consists of several layers including a substrate, a thin film transistor, a first passivation layer, an organic film layer, a common electrode, a second passivation layer, and a pixel electrode layer. The organic film layer contains a first via, while the common electrode covers the pixel area and includes a second via and a sloped wall surrounding the second via. The second via is connected to the first via, with a gap between the bottom edge of the sloped wall and the top edge of the first via. The second passivation layer includes a third via that communicates with the second via. The pixel electrode layer is arranged on the second passivation layer and is connected to the second metal layer through the first via, the second via, and the third via.

  • The array substrate consists of multiple layers including a thin film transistor, passivation layers, and electrode layers.
  • The organic film layer contains a first via, which allows for connections between different layers.
  • The common electrode covers the pixel area and includes a second via and a sloped wall surrounding it.
  • The second via is connected to the first via, allowing for electrical connections.
  • The second passivation layer includes a third via that communicates with the second via, further enhancing connectivity.
  • The pixel electrode layer is arranged on top of the second passivation layer and is connected to the second metal layer through multiple vias.

Potential applications of this technology:

  • This array substrate can be used in the manufacturing of display devices such as LCD screens or OLED panels.
  • It can also be used in touchscreens or other interactive display technologies.

Problems solved by this technology:

  • The array substrate allows for improved connectivity between different layers, ensuring proper functioning of the display device.
  • The use of multiple vias and passivation layers helps to prevent signal interference and improve overall performance.

Benefits of this technology:

  • The improved connectivity and signal integrity provided by this array substrate can result in better image quality and responsiveness in display devices.
  • The manufacturing method described in the patent application allows for efficient and reliable production of the array substrate.


Original Abstract Submitted

An array substrate and a method of manufacturing the same are provided. The array substrate includes a substrate, a thin film transistor, a first passivation layer, an organic film layer, a common electrode, a second passivation layer and a pixel electrode layer. The organic film layer includes a first via. The common electrode covers the pixel area and includes a second via and a sloped wall surrounding the second via. The second via is connected with the first via, and a gap is located between the bottom edge of the sloped wall and the top edge of the first via. The second passivation layer includes a third via communicating with the second via. The pixel electrode layer is arranged on the second passivation layer and is connected with the second metal layer through the first via, the second via, and the third via.

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