17620529. PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
- 1 PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17620529 titled 'PIEZOELECTRIC ELEMENT, PIEZOELECTRIC VIBRATOR AND MANUFACTURING METHOD AND DRIVING METHOD THEREOF, AND ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a piezoelectric element and vibrator with a heat conducting structure to reduce heat generated during vibration. The piezoelectric structure has an opening allowing a first electrode to partially expose, and a heat conducting structure is placed in the opening. The heat conducting structure helps dissipate heat generated by the vibrating piezoelectric structure.
- A piezoelectric structure is used with a first electrode partially exposed through an opening.
- A heat conducting structure is placed in the opening to dissipate heat.
- The opening reduces the heating area when the piezoelectric structure vibrates.
- The heat conducting structure further helps in heat dissipation during vibration.
Potential Applications
This technology can be applied in various electronic devices that utilize piezoelectric elements and vibrators. Some potential applications include:
- Mobile phones and tablets with haptic feedback systems.
- Wearable devices with vibration alerts or feedback.
- Ultrasonic devices for medical imaging or cleaning.
- Acoustic devices for audio applications.
Problems Solved
The technology addresses the following problems:
- Heat generation during the vibration of piezoelectric structures.
- Overheating of electronic devices due to excessive heat from piezoelectric elements.
- Reduced performance and lifespan of piezoelectric elements due to heat-related issues.
Benefits
The technology offers several benefits:
- Improved performance and reliability of electronic devices utilizing piezoelectric elements.
- Enhanced heat dissipation, reducing the risk of overheating.
- Extended lifespan of piezoelectric elements.
- More efficient and effective vibration and haptic feedback systems.
Original Abstract Submitted
A piezoelectric element, a piezoelectric vibrator and a manufacturing method and a driving method thereof, and an electronic device, and relates to field of piezoelectric technologies. According to the application, a piezoelectric structure is disposed on a first electrode and has an opening allowing the first electrode to penetrate through to be partially exposed, and a heat conducting structure is disposed in the opening. The opening penetrating through the piezoelectric structure is formed in the piezoelectric structure, such that the heating area is decreased when the piezoelectric structure vibrates, and heat generated by the piezoelectric structure is reduced, correspondingly; and the heat conducting structure is additionally disposed in the piezoelectric element to dissipate heat generated when the piezoelectric structure vibrates.
