17589955. DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME
Organization Name
Inventor(s)
Valentina Lacivita of Cambridge MA (US)
Jeong-Ju Cho of Lexington MA (US)
DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17589955 titled 'DIELECTRIC MATERIAL COMPRISING LEAD COMPOUND AND METHOD OF MAKING THE SAME
Simplified Explanation
The abstract describes an electrode assembly for electronic devices, which includes a first electrode and a dielectric layer made of a lead-containing compound. The compound can be one of several formulas, such as PbMgVO, PbTeO, PbZnVO, NaPbO, and many others.
- The electrode assembly includes a first electrode and a dielectric layer made of a lead-containing compound.
- The dielectric layer can be made of various lead-containing compounds, such as PbMgVO, PbTeO, PbZnVO, NaPbO, PbPO, and others.
- The electrode assembly is designed for use in electronic devices.
- The lead-containing compound in the dielectric layer provides specific properties and characteristics to the electrode assembly.
Potential applications of this technology:
- Electronic devices such as smartphones, tablets, and computers
- Capacitors and other energy storage devices
- Integrated circuits and microchips
Problems solved by this technology:
- Provides a reliable and efficient electrode assembly for electronic devices
- Offers a wide range of lead-containing compounds to tailor the dielectric layer properties
- Enhances the performance and functionality of electronic devices
Benefits of this technology:
- Improved performance and efficiency of electronic devices
- Increased reliability and durability of electrode assemblies
- Customizable dielectric layer properties for specific device requirements
Original Abstract Submitted
An electrode assembly including a first electrode and a dielectric layer on the first electrode. The dielectric layer comprises a lead-containing compound of the formula PbMgVO, PbTeO, PbZnVO, NaPbO, PbPO, PbZnSiO, PbInSiO, Pb(AsO)[B(AsO)], PbAlSiO, KPbO, PbTiAsO, PbO(VO), RbPbO, PbVO, PbAlO, Nd(AlO)(PbO), PbCo(TeO), Pb(BO)NO, a lead-containing oxyhalide of the formula Pb(ClO), Pb(BrO), PbOF, PbCOF, Pb(AsO)Cl, PbO(OH)Cl, Pb(BO)OCl, PbBOI, PbBOBr, PbBOCl, Pb(AsO)Cl, PbYFO, Pb(OPb)(BO)Br, PbLaOCl, a lead-containing phosphate of the formula PbPOI, PbInPO, PbMoPO, PbNi(PO), PbVO(PO), KPb(PO), Pb(MoO)(PO), PbO(PO), RbPb(PO), PbVOPO, Pb(PO)F, Pb(PO)Cl, Pb(PO)I, PbPO, or a combination thereof. The electrode assembly can be particularly useful in various electronic devices.
