17585932. SEMICONDUCTOR DIES INCLUDING LOW AND HIGH WORKFUNCTION SEMICONDUCTOR DEVICES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SEMICONDUCTOR DIES INCLUDING LOW AND HIGH WORKFUNCTION SEMICONDUCTOR DEVICES

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Meng-Han Lin of Hsinchu City (TW)

Chia-En Huang of Xinfeng Township (TW)

SEMICONDUCTOR DIES INCLUDING LOW AND HIGH WORKFUNCTION SEMICONDUCTOR DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17585932 titled 'SEMICONDUCTOR DIES INCLUDING LOW AND HIGH WORKFUNCTION SEMICONDUCTOR DEVICES

Simplified Explanation

The patent application describes a semiconductor die that includes two sets of semiconductor devices located at different locations on the die. Each set of devices has a different workfunction, which determines the time period for storing memory.

  • The semiconductor die has a first set of semiconductor devices located at one location and a second set of semiconductor devices located at a different location on the die.
  • The first set of devices has a lower workfunction, allowing them to store memory for a shorter time period.
  • The second set of devices has a higher workfunction, enabling them to store memory for a longer time period compared to the first set.
  • This arrangement allows for different memory storage capabilities within the same semiconductor die.

Potential applications of this technology:

  • Memory storage in electronic devices: This technology can be used in various electronic devices, such as smartphones, tablets, and computers, to provide different memory storage capabilities for different purposes.
  • Data retention in IoT devices: Internet of Things (IoT) devices often require different memory storage durations based on the specific application. This technology can cater to those requirements.
  • Wearable devices: Wearable devices, such as fitness trackers and smartwatches, can benefit from this technology by having different memory storage capabilities for different types of data.

Problems solved by this technology:

  • Limited memory storage options: Traditional semiconductor devices offer a fixed memory storage duration, limiting the flexibility and adaptability of electronic devices.
  • Inefficient use of memory: Some applications may require longer memory storage durations, while others may need shorter durations. This technology allows for optimized memory usage based on specific requirements.

Benefits of this technology:

  • Enhanced memory flexibility: By providing different memory storage durations within the same semiconductor die, this technology offers increased flexibility for various applications.
  • Efficient memory utilization: Different workfunctions enable optimized memory usage, ensuring that memory is not wasted or underutilized.
  • Cost-effective solution: Incorporating different memory storage capabilities within a single semiconductor die reduces the need for multiple components, resulting in cost savings.


Original Abstract Submitted

A semiconductor die comprises a first set of semiconductor devices disposed at a first location of the semiconductor die and a second set of semiconductor devices disposed at a second location of the semiconductor die different from the first location. Each of the first set of semiconductor devices have a first workfunction to cause each of the first set of semiconductor devices to store memory for a first time period. Moreover, each of the second set of semiconductor devices have a second workfunction that is higher greater than the first workfunction to cause each of the second set of semiconductor devices to store memory for a second time period greater than the first time period.