17572892. Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making simplified abstract (Microfabrica Inc.)

Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making

Organization Name

Microfabrica Inc.

Inventor(s)

Garret R. Smalley of Newhall CA (US)

Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making - A simplified explanation of the abstract

This abstract first appeared for US patent application 17572892 titled 'Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making

Simplified Explanation

The patent application describes microscale and millimeter scale multi-layer structures, such as probe structures used for making contact between electronic components in semiconductor testing applications. These structures have shell and core regions made of different materials, with the core regions offset from a symmetric, longitudinally extending position.

• The structures are designed for making contact between electronic components in semiconductor wafer, chip, and electronic component test applications.
• The structures consist of shell and core regions formed of different materials, with the core regions offset from a symmetric, longitudinally extending position.

Potential Applications

The technology described in the patent application could be applied in various industries and fields, including:

• Semiconductor testing
• Electronics manufacturing
• Microscale device fabrication

Problems Solved

The technology addresses several challenges in the field of electronic component testing and manufacturing, including:

• Ensuring reliable and accurate contact between electronic components
• Improving the efficiency and precision of testing processes
• Enhancing the performance of microscale and millimeter scale devices

Benefits

The use of multi-layer structures with shell and core regions offers several benefits, such as:

• Increased durability and longevity of probe structures
• Enhanced electrical conductivity and signal transmission
• Improved overall performance and reliability of electronic components

Potential Commercial Applications

The technology has potential commercial applications in industries such as:

• Semiconductor manufacturing
• Electronics testing and quality control
• Research and development of microscale devices

Possible Prior Art

One possible prior art in this field is the use of multi-layer structures in microscale and millimeter scale devices for improving contact and signal transmission. However, the specific design and configuration of the structures described in the patent application may be novel and innovative.

Unanswered Questions

How does the offset core regions in the structures affect the overall performance and reliability of electronic components?

The patent application mentions that the core regions are offset from a symmetric position, but it does not provide detailed information on the impact of this design feature on the functionality of the structures.

What materials are commonly used for the shell and core regions in similar multi-layer structures?

The patent application mentions that the structures consist of shell and core regions made of different materials, but it does not specify the types of materials typically used in such applications.

Original Abstract Submitted

Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position