17570710. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chih-Chang Cheng of Hsinchu City (TW)

Po-Chih Su of New Taipei City (TW)

Ruey-Hsin Liu of Hsin-Chu (TW)

Ming-Ta Lei of Hsin-Chu City (TW)

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17570710 titled 'SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION

Simplified Explanation

The present disclosure is about an integrated chip structure that includes two chiplets with different types of integrated chip devices. The chiplets are connected by inter-chiplet connectors.

  • The integrated chip structure consists of two chiplets with different types of integrated chip devices.
  • The first chiplet has a first type of integrated chip devices, while the second chiplet has a second type of integrated chip devices.
  • The chiplets are connected by inter-chiplet connectors that allow for electrical coupling between them.
  • The interconnects on the first chiplet have a different minimum width than the interconnects on the second chiplet.

Potential applications of this technology:

  • This integrated chip structure can be used in various electronic devices such as smartphones, tablets, and computers.
  • It can be utilized in the automotive industry for advanced driver assistance systems and autonomous vehicles.
  • The technology can also be applied in the healthcare sector for medical devices and equipment.

Problems solved by this technology:

  • The integrated chip structure allows for the integration of different types of integrated chip devices, enabling more functionality in a single chip.
  • The inter-chiplet connectors provide a means for electrical coupling between the chiplets, facilitating communication and data transfer.
  • The different minimum widths of the interconnects allow for optimized performance and efficiency of the integrated chip structure.

Benefits of this technology:

  • The integrated chip structure offers increased functionality and performance due to the integration of different types of integrated chip devices.
  • It enables more compact and efficient designs of electronic devices by reducing the need for separate chips for different functionalities.
  • The technology allows for improved communication and data transfer between chiplets, enhancing overall system performance.


Original Abstract Submitted

The present disclosure relates an integrated chip structure. The integrated chip structure includes a first chiplet predominantly having a first plurality of integrated chip devices coupled to a first plurality of interconnects over a first substrate. The first plurality of integrated chip devices are a first type of integrated chip device. The integrated chip structure further includes a second chiplet predominantly having a second plurality of integrated chip devices coupled to a second plurality of interconnects over a second substrate. The second plurality of integrated chip devices are a second type of integrated chip device different than the first type of integrated chip device. One or more inter-chiplet connectors are between the first and second chiplets and are configured to electrically couple the first and second chiplets. The first plurality of interconnects have a first minimum width different than a second minimum width of the second plurality of interconnects.

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