17570647. Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)

Temperature Control Element Utilized in Device Die Packages

Organization Name

GOOGLE LLC

Inventor(s)

Yingying Wang of Sunnyvale CA (US)

Emad Samadiani of Cypress CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

Padam Jain of San Jose CA (US)

Xiaojin Wei of Dublin CA (US)

Teckgyu Kang of Saratoga CA (US)

Sudharshan Sugavanesh Udhayakumar of Santa Clara CA (US)

Yingshi Tang of Danville CA (US)

Temperature Control Element Utilized in Device Die Packages - A simplified explanation of the abstract

This abstract first appeared for US patent application 17570647 titled 'Temperature Control Element Utilized in Device Die Packages

Simplified Explanation

The abstract describes an IC die (integrated circuit die) that includes a temperature control element suitable for a three-dimensional IC package with enhanced thermal control and management.

• The temperature control element helps control the temperature of the IC die when it is in operation.
• It has thermal dissipating features on one surface of the IC die to efficiently control and dissipate thermal energy.
• The opposite surface of the IC die includes various devices that generate thermal energy when in operation, such as semiconductors, transistors, electrical components, circuits, etc.
• The temperature control element provides high efficiency heat dissipation, specifically designed for 3D IC package structures and requirements.

Potential Applications

• Three-dimensional integrated circuit packages
• Electronic devices with high thermal energy generation

Problems Solved

• Enhanced thermal control and management in three-dimensional IC packages
• Efficient dissipation of thermal energy generated by various devices on the IC die

Benefits

• Improved temperature control of IC die during operation
• High efficiency heat dissipation suitable for 3D IC package structures
• Enhanced thermal management in electronic devices with high thermal energy generation

Original Abstract Submitted

An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.