17564889. INTEGRATED SENSING AND DISPLAY SYSTEM simplified abstract (Meta Platforms Technologies, LLC)

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INTEGRATED SENSING AND DISPLAY SYSTEM

Organization Name

Meta Platforms Technologies, LLC

Inventor(s)

Andrew Samuel Berkovich of Bellevue WA (US)

Warren Andrew Hunt of Woodinville WA (US)

Daniel Morgan of Seattle WA (US)

Shlomo Alkalay of Redmond WA (US)

Jack Thomas Lavier of Sammamish WA (US)

INTEGRATED SENSING AND DISPLAY SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17564889 titled 'INTEGRATED SENSING AND DISPLAY SYSTEM

Simplified Explanation

The patent application describes an apparatus for integrating sensing and display systems using multiple semiconductor layers enclosed in a semiconductor package.

  • The apparatus includes a first semiconductor layer with an image sensor, a second semiconductor layer with a display, and a third semiconductor layer with compute circuits supporting image sensing and display operations.
  • The semiconductor package encloses the three layers and includes openings to expose the image sensor and display.
  • The layers form a stack structure along an axis, with the third layer sandwiched between the first and second layers.

Potential Applications

This technology could be applied in:

  • Smartphones and tablets for improved camera and display integration.
  • Augmented reality devices for seamless image capture and display.

Problems Solved

This technology solves the problem of integrating image sensing and display functions in a compact and efficient manner.

Benefits

  • Reduced size and weight of devices.
  • Improved performance and efficiency of image sensing and display operations.

Potential Commercial Applications

  • Consumer electronics industry for mobile devices.
  • Medical imaging devices for enhanced diagnostic capabilities.

Possible Prior Art

One possible prior art could be the integration of image sensors and displays in smartphones and tablets, but the specific configuration described in the patent application may be novel.

Unanswered Questions

How does this technology impact power consumption in devices?

This article does not provide information on the power consumption implications of integrating sensing and display systems in the described apparatus.

What are the potential challenges in manufacturing this integrated semiconductor package?

The article does not address the potential manufacturing challenges that may arise in producing the integrated sensing and display system described in the patent application.


Original Abstract Submitted

In one example, an apparatus for integrating sensing and display system includes a first semiconductor layer that includes an image sensor; a second semiconductor layer that includes a display; a third semiconductor layer that includes compute circuits configured to support an image sensing operation by the image sensor and a display operation by the display; and a semiconductor package that encloses the first, second, and third semiconductor layers, the semiconductor package further including a first opening to expose the image sensor and a second opening to expose the display. The first, second, and third semiconductor layers form a first stack structure along a first axis. The third semiconductor layer is sandwiched between the first semiconductor layer and the second semiconductor layer in the first stack structure.