17551829. ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Oleg Gluschenkov of Tannersville NY (US)

Eric Miller of Watervliet NY (US)

Yasir Sulehria of Niskayuna NY (US)

ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17551829 titled 'ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT

Simplified Explanation

The patent application describes a semiconductor structure that includes multiple devices arranged at different levels within the structure. The structure includes lower devices and upper devices, with the upper devices positioned vertically above the lower devices. An angled via is used to electrically connect a lower device to an upper device, with the via having an angled surface that is tilted towards the upper device.

  • The semiconductor structure includes lower and upper devices positioned at different levels.
  • An angled via is used to connect a lower device to an upper device.
  • The angled via has a surface that is tilted towards the upper device.
  • The structure allows for efficient electrical connections between devices at different levels.

Potential Applications

  • This technology can be used in the manufacturing of integrated circuits and semiconductor devices.
  • It can improve the performance and efficiency of electronic devices by enabling better electrical connections between different levels of the semiconductor structure.

Problems Solved

  • Traditional semiconductor structures often face challenges in efficiently connecting devices at different levels.
  • The angled via in this technology solves this problem by providing a tilted surface that facilitates electrical connections between different levels.

Benefits

  • The semiconductor structure allows for improved electrical connections between devices at different levels.
  • It can enhance the performance and efficiency of electronic devices.
  • The technology provides a simplified and efficient solution for connecting devices within a semiconductor structure.


Original Abstract Submitted

Embodiments disclosed herein include a semiconductor structure having a first lower device and a second lower device laterally adjacent to the first lower device at a lower level of the semiconductor structure, a first upper device and a second upper device laterally adjacent to the first upper device at an upper level of the semiconductor structure. The upper level may be vertically above the lower level. The semiconductor structure may also include an angled via electrically connecting the lower device and the first upper device. The angled via may include an angled surface laterally between the first upper device and the second upper device that is angled toward the first upper device relative to a vertical axis.

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