17545713. NANOSHEET DEVICE WITH AIR-GAPED SOURCE/DRAIN REGIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

From WikiPatents
Jump to navigation Jump to search

NANOSHEET DEVICE WITH AIR-GAPED SOURCE/DRAIN REGIONS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

HUIMEI Zhou of Albany NY (US)

Yi Song of Albany NY (US)

Kangguo Cheng of Schenectady NY (US)

Ruilong Xie of Niskayuna NY (US)

NANOSHEET DEVICE WITH AIR-GAPED SOURCE/DRAIN REGIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17545713 titled 'NANOSHEET DEVICE WITH AIR-GAPED SOURCE/DRAIN REGIONS

Simplified Explanation

Abstract: A nanosheet device is provided that has high quality epitaxially grown source/drain regions and reduced parasitic capacitance which are afforded by forming an air gap between an epitaxially grown source/drain region and a semiconductor substrate. The isolation provided by the air gap does not need to extend beneath the channel region of the nanosheet device.

Patent/Innovation Explanation:

  • Nanosheet device with high quality epitaxially grown source/drain regions and reduced parasitic capacitance.
  • Air gap is formed between the epitaxially grown source/drain region and the semiconductor substrate.
  • The air gap provides isolation without extending beneath the channel region of the nanosheet device.

Potential Applications:

  • Semiconductor industry
  • Electronics manufacturing
  • Integrated circuits

Problems Solved:

  • High quality epitaxially grown source/drain regions
  • Reduced parasitic capacitance
  • Isolation without extending beneath the channel region

Benefits:

  • Improved performance of nanosheet devices
  • Enhanced efficiency of semiconductor devices
  • Reduced interference and capacitance issues


Original Abstract Submitted

A nanosheet device is provided that has high quality epitaxially grown source/drain regions and reduced parasitic capacitance which are afforded by forming an air gap between an epitaxially grown source/drain region and a semiconductor substrate. The isolation provided by the air gap does not need to extend beneath the channel region of the nanosheet device.