17543072. UNDERFILL VACUUM PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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UNDERFILL VACUUM PROCESS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Toyohiro Aoki of Yokohama (JP)

CHINAMI Marushima of Urayasu-city (JP)

RISA Miyazawa of Isehara (JP)

Akihiro Horibe of Yokohama-shi (JP)

Takashi Hisada of Hachiouji-shi (JP)

UNDERFILL VACUUM PROCESS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17543072 titled 'UNDERFILL VACUUM PROCESS

Simplified Explanation

The abstract describes a patent application for an electronic device that involves dispensing an underfill material around the perimeter of an integrated circuit (IC) chip bonded to a supporting substrate. The underfill material creates a void between the IC chip and the supporting substrate. The void can be reduced in size by applying a vacuum through an opening in either the IC chip or the supporting substrate. Once the void is reduced, the opening is sealed with a sealing plate, and the underfill material is cured to further reduce the size of the void.

  • An electronic device is formed by dispensing underfill material around an IC chip bonded to a supporting substrate.
  • A void is created between the IC chip and the supporting substrate.
  • An opening is made through either the IC chip or the supporting substrate to access the void.
  • A vacuum is applied through the opening to reduce the size of the void.
  • The opening is sealed with a sealing plate.
  • The underfill material is cured to further reduce the size of the void.

Potential Applications

  • Manufacturing of electronic devices with improved structural integrity.
  • Assembly of IC chips onto supporting substrates with reduced voids.

Problems Solved

  • Minimizes the presence of voids between IC chips and supporting substrates.
  • Enhances the reliability and performance of electronic devices.

Benefits

  • Improved structural stability and reliability of electronic devices.
  • Enhanced electrical performance and longevity of IC chips.
  • Streamlined manufacturing process for electronic devices.


Original Abstract Submitted

An electronic device is formed by dispensing an underfill material around a perimeter of an integrated circuit (IC) chip bonded to a supporting substrate. A void in present in the underfill material that is present between the IC chip and the supporting substrate. An opening is present through at least one of the IC chip and the supporting substrate into communication with the void. A vacuum may be applied to the void through the opening that is present through the IC chip to reduce a size of the void to a first volume. The opening that is present through the IC chip is sealed with a sealing plate. The underfill material is cured after the sealing of the opening to reduce of the void to at least a second volume that is less than the first volume.

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