17542882. THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

GANGADHARA RAJA Muthinti of Albany NY (US)

Koichi Motoyama of Clifton Park NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Christopher J. Penny of Saratoga Springs NY (US)

THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 17542882 titled 'THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL

Simplified Explanation

The abstract describes a computer-implemented method for assessing roughness in metallic lines of an integrated circuit (IC). The method involves developing a library of roughness characterizations for metal lines with varying characteristics and dimensions. A testable IC is fabricated, and a location of interest (LoI) is identified where roughness of a metal line could impact IC performance. A roughness model is developed from the library for metal lines with characteristics and dimensions corresponding to the metal line within the LoI. The library and roughness model are refined based on a comparison with the actual roughness of the metal line within the LoI to obtain a final roughness model.

  • Developing a library of roughness characterizations for metal lines with varying characteristics and dimensions
  • Fabricating a testable IC and identifying a location of interest (LoI) where roughness of a metal line could impact IC performance
  • Developing a roughness model from the library for metal lines with characteristics and dimensions corresponding to the metal line within the LoI
  • Refining the library and roughness model based on a comparison with the actual roughness of the metal line within the LoI to obtain a final roughness model

Potential Applications

  • Quality control in the manufacturing of integrated circuits
  • Optimization of metal line design in integrated circuits
  • Improving the performance and reliability of integrated circuits

Problems Solved

  • Assessing the roughness of metallic lines in integrated circuits
  • Identifying locations where roughness could impact the performance of integrated circuits
  • Developing accurate roughness models for specific metal lines in integrated circuits

Benefits

  • Enhanced quality control in integrated circuit manufacturing
  • Improved performance and reliability of integrated circuits
  • Cost savings through optimized metal line design in integrated circuits


Original Abstract Submitted

A computer-implemented method of assessing roughness in metallic lines of an integrated circuit (IC) is provided. The computer-implemented method includes developing a library of roughness characterizations for metal lines of varying characteristics and dimensions. The computer-implemented method further includes fabricating a testable IC and identifying, in the testable IC, a location of interest (LoI) at which roughness of a metal line within the LoI could impact IC performance. Also, the computer-implemented method includes developing, from the library, a roughness model using the roughness characterizations for those metal lines having characteristics and dimensions corresponding to those of the metal line within the LoI and refining the library and the roughness model based on a comparison of the roughness model and an actual roughness of the metal line within the LoI to obtain a final roughness model.

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