17529646. INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE simplified abstract (International Business Machines Corporation)

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INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

Organization Name

International Business Machines Corporation

Inventor(s)

Sayuri Hada of Machida-shi (JP)

Toyohiro Aoki of Yokohama (JP)

Takashi Hisada of Hachiouji-shi (JP)

Shintaro Yamamichi of Kunitachi (JP)

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17529646 titled 'INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

Simplified Explanation

The patent application describes an apparatus for injecting solder material into via holes on a wafer's top surface. The apparatus includes an injection head with a contact surface for the wafer and at least one aperture for injecting solder material into the via holes. An evacuating device is connected to the injection head to remove gas from the via holes. The injection head also has a chamfer part on the edge of the contact surface.

  • The apparatus is designed for injecting solder material into via holes on a wafer's top surface.
  • It includes an injection head with a contact surface and at least one aperture for injecting solder material into the via holes.
  • An evacuating device is connected to the injection head to remove gas from the via holes.
  • The injection head has a chamfer part on the edge of the contact surface.

Potential Applications

  • Semiconductor manufacturing
  • Electronics assembly

Problems Solved

  • Efficiently injecting solder material into via holes on a wafer's top surface
  • Removing gas from the via holes to ensure proper soldering

Benefits

  • Improved soldering process for via holes on a wafer
  • Enhanced efficiency and accuracy in semiconductor manufacturing and electronics assembly.


Original Abstract Submitted

An apparatus for injecting solder material in via holes located in a top surface of a wafer is provided. The apparatus includes an injection head having a contact surface for contacting the top surface of the wafer, and at least one aperture for injecting the solder material though the injection head into the via holes. The apparatus further includes an evacuating device connected to the injection head for evacuating gas from the via holes. The injection head has a chamfer part on an edge of a contact surface contacting the top surface of the wafer.

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