17528910. Bridge Chip with Through Via simplified abstract (International Business Machines Corporation)

From WikiPatents
Jump to navigation Jump to search

Bridge Chip with Through Via

Organization Name

International Business Machines Corporation

Inventor(s)

Mukta Ghate Farooq of Hopewell Junction NY (US)

James J. Kelly of Schenectady NY (US)

Bridge Chip with Through Via - A simplified explanation of the abstract

This abstract first appeared for US patent application 17528910 titled 'Bridge Chip with Through Via

Simplified Explanation

The abstract describes a patent application for techniques to connect chips using a bridge chip with through vias. The bridge chip is attached to two other chips and has conductive through vias that connect it to one of the other chips. The bridge chip includes a wiring layer with metal lines between two capping layers, and the through vias directly contact the sidewall of the metal lines. The patent also provides a method for integrating chips using this bridge chip.

  • The patent describes a technique for interconnecting chips using a bridge chip with through vias.
  • The bridge chip is attached to two other chips and has conductive through vias that connect it to one of the other chips.
  • The bridge chip includes a wiring layer with metal lines between two capping layers.
  • The through vias directly contact the sidewall of the metal lines.
  • The patent also provides a method for integrating chips using this bridge chip.

Potential Applications

  • This technology can be used in various electronic devices that require interconnecting multiple chips.
  • It can be applied in the fields of telecommunications, computing, and consumer electronics.

Problems Solved

  • Traditional methods of interconnecting chips can be complex and time-consuming.
  • This technology provides a simplified and efficient way to connect chips using a bridge chip with through vias.
  • It solves the problem of limited space for interconnections in small electronic devices.

Benefits

  • The use of a bridge chip with through vias allows for a compact and efficient interconnection between chips.
  • The direct contact of through vias with the sidewall of metal lines improves the electrical performance of the interconnections.
  • The method described in the patent provides a cost-effective and scalable solution for integrating chips.


Original Abstract Submitted

Techniques for interconnecting chips using a bridge chip having through vias is provided. In one aspect, a structure includes: a bridge chip attached to at least a first chip and a second chip, wherein the bridge chip has at least one conductive through via connecting the bridge chip to one of the first chip and the second chip. The bridge chip can include a wiring layer having metal lines present between a first capping layer and a second capping layer, and the at least one conductive through via can directly contact at least a sidewall of at least one of the metal lines. A method of integrating chips using the present bridge chip is also provided.

Retrieved from "http://wikipatents.org/index.php?title=17528910._Bridge_Chip_with_Through_Via_simplified_abstract_(International_Business_Machines_Corporation)&oldid=23574"