17525536. SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS simplified abstract (MICROSOFT TECHNOLOGY LICENSING, LLC)

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS

Organization Name

MICROSOFT TECHNOLOGY LICENSING, LLC

Inventor(s)

Bharath Ramakrishnan of Bellevue WA (US)

Husam Atallah Alissa of Redmond WA (US)

Eric C. Peterson of Woodinville WA (US)

Nicholas Andrew Keehn of Kirkland WA (US)

Christian L. Belady of Mercer Island WA (US)

Ioannis Manousakis of Redmond WA (US)

Dennis Trieu of Calgary (CA)

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17525536 titled 'SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF HIGH-CAPACITY DEVICES IN IMMERSION-COOLED DATACENTERS

Simplified Explanation

The abstract describes a method for managing the heat generated by a computing device using two different working fluids. The first electronic component is immersed in a first working fluid in a first volume, while the second electronic component is immersed in a second working fluid in a second volume. By changing the pressure in the first volume, the boiling temperature of the first working fluid can be altered.

• The method involves immersing electronic components in working fluids to manage heat.
• Two different working fluids are used for different components.
• The pressure in the first volume is changed to adjust the boiling temperature of the first working fluid.

Potential Applications

• Thermal management of computing devices such as laptops, desktops, or servers.
• Cooling of high-performance electronic components in industries like aerospace or automotive.
• Heat dissipation in data centers or server farms.

Problems Solved

• Overheating of electronic components, which can lead to performance degradation or even failure.
• Inadequate cooling solutions for high-performance computing devices.
• Difficulty in managing heat in compact or densely packed electronic systems.

Benefits

• Improved thermal management, leading to better performance and reliability of computing devices.
• Enhanced cooling capabilities for high-performance electronic components.
• Efficient heat dissipation in compact or densely packed electronic systems.

Original Abstract Submitted

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.