17459672. SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Po-Wei Wang of Taichung City (TW)

Chao-Hsing Lai of Taichung City (TW)

Hsiao-Feng Lu of Taichung City (TW)

SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17459672 titled 'SHOWERHEAD ASSEMBLY AND METHOD OF SERVICING ASSEMBLY FOR SEMICONDUCTOR MANUFACTURING

Simplified Explanation

The patent application describes a device for cleaning wafers in a semiconductor manufacturing apparatus. It includes a showerhead and an adjustable distributor assembly.

  • The showerhead is positioned over a wafer stage in a cleaning chamber and is designed to release cleaning material towards the surface of the wafer.
  • The adjustable distributor assembly is located within the showerhead and allows the cleaning material to pass through it.
  • The adjustable distributor assembly consists of a base sheet and multiple control sheets.
  • The base sheet has openings, while the control sheets have openings as well and can slide to adjust the size of the openings.
  • This allows for selective adjustment of the openings, providing control over the distribution and flow of the cleaning material.

Potential Applications

  • Semiconductor manufacturing: This device can be used in semiconductor manufacturing processes to clean wafers effectively and efficiently.

Problems Solved

  • Inadequate cleaning: The device ensures that the cleaning material is evenly distributed and reaches all areas of the wafer surface, improving the cleaning process.
  • Lack of control: The adjustable distributor assembly allows for precise control over the distribution and flow of the cleaning material, addressing the issue of inconsistent cleaning results.

Benefits

  • Improved cleaning efficiency: The device ensures that the cleaning material is effectively distributed across the entire wafer surface, resulting in more thorough cleaning.
  • Enhanced cleaning control: The adjustable distributor assembly allows for precise adjustment of the cleaning material flow, providing better control over the cleaning process.
  • Cost savings: The device's efficient cleaning capabilities can lead to reduced cleaning time and material usage, resulting in cost savings for semiconductor manufacturers.


Original Abstract Submitted

A device for cleaning a wafer in a semiconductor manufacturing apparatus includes a showerhead and an adjustable distributor assembly. The showerhead is disposed over a wafer stage within a cleaning chamber and configured to eject cleaning material through the showerhead towards a cleaning surface of a wafer. The adjustable distributor assembly is disposed within the showerhead through which the cleaning material passes. The adjustable distributor assembly includes a base sheet and a plurality of control sheets. The base sheet includes base openings, and the plurality of control sheets include control openings and are configured to slidably mate with the base sheet to provide selectively adjustable openings.

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