View source for 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
Jump to navigation
Jump to search
You do not have permission to edit this page, for the following reason:
You can view and copy the source of this page.