17425538. HEADSET INCLUDING IN-EAR MICROPHONE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

HEADSET INCLUDING IN-EAR MICROPHONE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Haekeu Park of Suwon-si, Gyeonggi-do (KR)

Kyeongcheol Yoon of Suwon-si, Gyeonggi-do (KR)

Hyeonyeong Jeong of Suwon-si, Gyeonggi-do (KR)

Sunghoon Cho of Suwon-si, Gyeonggi-do (KR)

Seonmi Kim of Suwon-si, Gyeonggi-do (KR)

Jeock Lee of Suwon-si, Gyeonggi-do (KR)

Seyoun Kwon of Suwon-si, Gyeonggi-do (KR)

HEADSET INCLUDING IN-EAR MICROPHONE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17425538 titled 'HEADSET INCLUDING IN-EAR MICROPHONE

Simplified Explanation

The abstract describes a headset with an in-ear microphone. The headset includes a frame with surfaces facing different directions and a side surface surrounding a space between the surfaces. It also has a recessed speaker seating portion and a space between the seating portion and one of the surfaces. The headset further includes a speaker hole, a microphone hole, and an acoustic hole. It has printed circuit boards connected to the microphone and speaker, and a microphone aligned with a via hole on one of the circuit boards.

• The headset includes a frame with surfaces facing different directions and a side surface surrounding a space between the surfaces.
• It has a recessed speaker seating portion and a space between the seating portion and one of the surfaces.
• The headset includes a speaker hole, a microphone hole, and an acoustic hole.
• It has printed circuit boards connected to the microphone and speaker, and a microphone aligned with a via hole on one of the circuit boards.

Potential applications of this technology:

• Communication devices: The headset can be used for hands-free communication in various devices such as smartphones, tablets, and computers.
• Gaming: The headset can enhance the gaming experience by providing clear audio and voice communication.
• Virtual reality: The in-ear microphone can be used in virtual reality headsets to capture audio and provide immersive experiences.

Problems solved by this technology:

• Improved audio quality: The in-ear microphone and speaker design help in capturing and reproducing high-quality audio.
• Comfortable fit: The recessed speaker seating portion and in-ear design provide a comfortable fit for the user.
• Noise cancellation: The acoustic hole and microphone placement help in reducing background noise and improving voice clarity.

Benefits of this technology:

• Enhanced user experience: The headset provides clear audio and voice communication, enhancing the overall user experience.
• Convenience: The hands-free design allows users to easily communicate while performing other tasks.
• Versatility: The headset can be used in various applications such as communication, gaming, and virtual reality.

Original Abstract Submitted

A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible.