17401252. Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms simplified abstract (Microfabrica Inc.)
Contents
- 1 Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the longitudinal plastic deformation process affect the durability of the probes?
- 1.11 Are there any limitations to the size or type of electronic devices that can be tested using these probes?
- 1.12 Original Abstract Submitted
Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms
Organization Name
Inventor(s)
Michael S. Lockard of Lake Elizabeth CA (US)
Uri Frodis of Los Angeles CA (US)
Dennis R. Smalley of Newhall CA (US)
Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms - A simplified explanation of the abstract
This abstract first appeared for US patent application 17401252 titled 'Probe Arrays and Improved Methods for Making and Using Longitudinal Deformation of Probe Preforms
Simplified Explanation
The patent application describes arrays of probes for testing electronic devices, such as semiconductor devices, which are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns. These preforms are then longitudinally plastically deformed to yield probes with extended longitudinal lengths. Probes may have deformable spring elements formed from single or multi-layer structures, and arrays may include laterally overlapping or interlaced structures that become laterally displaced upon deformation.
- Probes for testing electronic devices
- Arrays of probes formed from preforms
- Longitudinal plastic deformation to extend probe length
- Deformable spring elements in probes
- Lateral displacement of structures in arrays upon deformation
Potential Applications
The technology can be applied in:
- Wafer level testing of semiconductor devices
- Socket level testing of electronic devices
- Quality control testing in manufacturing processes
Problems Solved
This technology helps to:
- Improve testing accuracy and efficiency
- Increase the reliability of test results
- Reduce the need for manual testing procedures
Benefits
The benefits of this technology include:
- Enhanced testing capabilities
- Cost-effective testing solutions
- Increased productivity in device manufacturing processes
Potential Commercial Applications
The technology can be utilized in various industries for:
- Semiconductor manufacturing
- Electronics production
- Quality assurance testing services
Possible Prior Art
One possible prior art could be the use of traditional probes for testing electronic devices, which may not have the same level of flexibility and efficiency as the arrays of probes described in this patent application.
Unanswered Questions
How does the longitudinal plastic deformation process affect the durability of the probes?
The article does not provide information on the long-term durability of the probes after undergoing the plastic deformation process. It would be important to understand if this process affects the lifespan of the probes and if they need to be replaced more frequently.
Are there any limitations to the size or type of electronic devices that can be tested using these probes?
The article does not mention any restrictions on the size or type of electronic devices that can be tested using these probes. It would be helpful to know if there are any limitations in terms of device dimensions or materials that could impact the effectiveness of the testing process.
Original Abstract Submitted
Probes for testing (e.g. wafer level testing or socket level testing) of electronic devices (e.g. semiconductor devices) and more particularly, arrays of such probes are provided. Probes are formed by initially fabricating probe preforms in batch with bases and/or ends located in array patterns, directly or indirectly on one or more build substrates with the arrayed preforms being in a longitudinally compressed state and whereafter the preforms are longitudinally plastically deformed to yield probes or partially formed probes with extended longitudinal lengths. Probes may be formed with deformable spring elements formed from one or more single layers which are joined by vertical elements located on other layers or they may be formed by spring elements that are formed as multi-layer structures. Arrays may include probe preforms with laterally overlapping or interlaced structures (but longitudinally displaced) which may remain laterally overlapping or become laterally displaced upon plastic deformation.
