17383449. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chih-Hao Chen of Taipei City (TW)
Li-Hui Cheng of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17383449 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract describes a semiconductor package that includes a redistribution structure, multiple semiconductor devices, and multiple heat dissipation films. The semiconductor devices are mounted on the redistribution structure, and the heat dissipation films are placed on top of the semiconductor devices. Trenches are present between each pair of heat dissipation films and between each pair of semiconductor devices.
- The semiconductor package includes a redistribution structure, semiconductor devices, and heat dissipation films.
- The semiconductor devices are mounted on the redistribution structure.
- The heat dissipation films are placed on top of the semiconductor devices.
- Trenches are present between each pair of heat dissipation films.
- Trenches are also present between each pair of semiconductor devices.
Potential Applications
- Electronics industry
- Semiconductor manufacturing
- Integrated circuit packaging
Problems Solved
- Efficient heat dissipation in semiconductor devices
- Improved thermal management in electronic systems
- Enhanced performance and reliability of semiconductor devices
Benefits
- Effective cooling of semiconductor devices
- Reduction in thermal resistance
- Prevention of overheating and damage to electronic components
- Improved overall system performance and longevity
Original Abstract Submitted
A semiconductor package includes a redistribution structure, a plurality of semiconductor devices, and a plurality of heat dissipation films. The plurality of semiconductor devices mounted on the redistribution structure. The plurality of heat dissipation films are respectively disposed on and jointly covering upper surfaces of the plurality of semiconductor devices. A plurality of trenches are respectively extended between each two of the plurality of heat dissipations and extended between each two of the plurality of semiconductor devices.
