16965495. ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
Contents
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
Organization Name
BOE TECHNOLOGY GROUP CO., LTD.
Inventor(s)
ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 16965495 titled 'ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a method for manufacturing an array substrate, which involves several steps including forming active layers, gates, insulating layers, and metal layers.
- The method begins by forming a first active layer on a base substrate.
- A second active layer is then formed on top of the first active layer.
- A second gate is formed on the second active layer.
- A first insulating layer is applied to cover the first active layer and the second gate.
- The first insulating layer is patterned to create via holes on both sides of the second gate, exposing the second active layer.
- A first metal layer is deposited into the via holes and on top of the first insulating layer.
- The first metal layer is then patterned, removing some of it above the first active layer to expose the first insulating layer.
- The first insulating layer is etched using the patterned first metal layer as a mask, creating second via holes above the first active layer to expose it.
- Finally, the exposed first active layer is cleaned.
Potential applications of this technology:
- Manufacturing of array substrates for electronic devices such as displays or sensors.
Problems solved by this technology:
- Provides a method for manufacturing array substrates with improved electrical connections between layers.
- Allows for precise patterning and etching of insulating layers to create via holes.
Benefits of this technology:
- Enables the production of high-quality array substrates with improved performance and reliability.
- Offers a simplified and efficient manufacturing process for array substrates.
- Enhances the overall functionality and durability of electronic devices.
Original Abstract Submitted
Provided are an array substrate and a manufacturing method thereof, the manufacturing method includes: forming a first active layer on a base substrate; forming a second active layer; forming a second gate on the second active layer; forming a first insulating layer covering the first active layer on the second gate; patterning the first insulating layer to form first via holes at both sides of the second gate to expose the second active layer; depositing a first metal layer in the first via holes and on the first insulating layer; patterning the first metal layer, removing a part of the first metal layer above the first active layer to expose the first insulating layer; etching the first insulating layer using the patterned first metal layer as a mask, forming second via holes above the first active layer to expose the first active layer; cleaning the exposed first active layer.
