US Patent Application 18354668. METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE simplified abstract

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METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Chia-Kuei Hsu of Hsinchu (TW)

Ming-Chih Yew of Hsinchu City (TW)

Po-Hao Tsai of Taoyuan City (TW)

Po-Yao Lin of Hsinchu County (TW)

Shin-Puu Jeng of Hsinchu (TW)

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18354668 titled 'METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a redistribution structure that includes multiple layers of dielectric material and a pad pattern.

  • The structure consists of a first dielectric layer, a pad pattern, and a second dielectric layer.
  • The pad pattern is placed on top of the first dielectric layer and consists of a pad portion and a peripheral portion.
  • The pad portion is embedded within the first dielectric layer, with its lower surface being at the same level as the lower surface of the first dielectric layer.
  • The peripheral portion surrounds the pad portion.
  • The second dielectric layer is then placed on top of the pad pattern.
  • The second dielectric layer includes extending portions that go through the peripheral portion of the pad pattern.
  • The extending portions provide additional connectivity and routing options within the redistribution structure.


Original Abstract Submitted

A redistribution structure includes a first dielectric layer, a pad pattern, and a second dielectric layer. The pad pattern is disposed on the first dielectric layer and includes a pad portion and a peripheral portion. The pad portion is embedded in the first dielectric layer, wherein a lower surface of the pad portion is substantially coplanar with a lower surface of the first dielectric layer. The peripheral portion surrounds the pad portion. The second dielectric layer is disposed on the pad pattern and includes a plurality of extending portions extending through the peripheral portion.

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