US Patent Application 18356212. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Sheng-Chieh Yang of Hsinchu (TW)

Shing-Chao Chen of Hsinchu County (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Chih-Wei Lin of Hsinchu County (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18356212 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The patent application describes a semiconductor package that includes a semiconductor device, an encapsulating material, and a redistribution structure.

• The semiconductor device has conductive bumps and a dielectric film encapsulating them.
• The dielectric film is made of an epoxy resin and a filler material.
• The dielectric film isolates the conductive bumps from the encapsulating material.
• The redistribution structure is connected to the conductive bumps.

Original Abstract Submitted

A semiconductor package includes a semiconductor device, an encapsulating material encapsulating the semiconductor device, and a redistribution structure disposed over the encapsulating material and the semiconductor device. The semiconductor device includes conductive bumps and a dielectric film encapsulating the conductive bumps, where a material of the dielectric film comprises an epoxy resin and a filler. The conductive bumps are isolated from the encapsulating material by the dielectric film. The redistribution structure is electrically connected to the conductive bumps.