US Patent Application 18354662. PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE simplified abstract

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PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.


Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18354662 titled 'PACKAGE, OPTICAL DEVICE, AND MANUFACTURING METHOD OF PACKAGE

Simplified Explanation

The patent application describes a package that includes a photonic integrated circuit die and an electric integrated circuit die.

  • The photonic integrated circuit die consists of a substrate and a waveguide.
  • The substrate has a notch that is filled with air.
  • The waveguide is placed over the substrate, with a portion overlapping the substrate and another portion overlapping the notch.
  • The electric integrated circuit die is positioned on top of the photonic integrated circuit die.


Original Abstract Submitted

A package includes a photonic integrated circuit die and an electric integrated circuit die. The photonic integrated circuit die includes a substrate and a waveguide. The substrate has a notch and the notch is occupied by air. The waveguide is disposed over the substrate. In a top view, a first portion of the waveguide is overlapped with the substrate and a second portion of the waveguide is overlapped with the notch. The electric integrated circuit die is disposed over the photonic integrated circuit die.

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