US Patent Application 18101319. SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract

From WikiPatents
Revision as of 10:51, 9 November 2023 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Organization Name

Samsung Electronics Co., Ltd.


Inventor(s)

Wan Gi Sohn of Suwon-si (KR)

Kyeong Hwan Kang of Suwon-si (KR)

Sung Hyun Bae of Suwon-si (KR)

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18101319 titled 'SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Simplified Explanation

The patent application describes a semiconductor memory device with storage patterns on a substrate.

  • The substrate extends in two directions that intersect each other.
  • The storage patterns are spaced apart from each other in both directions.
  • Each storage pattern extends in a third direction that intersects the plane defined by the first two directions.
  • Each storage pattern has a face in contact with a storage contact.
  • The face of each storage pattern has a width along each of the first two directions.
  • The width of the face of the storage patterns increases relative to each other in the first direction.
  • The spacing between adjacent storage patterns decreases relative to each other in the first direction.


Original Abstract Submitted

A semiconductor memory device is provided that includes: a substrate extending in each of a first direction and a second direction that intersect each other; and storage patterns disposed on the substrate, and spaced apart from each other in each of the first and second directions. Each of the storage patterns extends in a third direction intersecting a plane defined by the first and second directions, and comprises a face in contact with a respective one from among storage contacts. The face of each of the storage patterns has a first width along the first direction and a second width along the second direction. The first width of the face of the storage patterns increases in a relative manner to each other in the first direction, while spacings in the first direction between adjacent ones of the storage patterns decrease in a relative manner to each other in the first direction.