Samsung electronics co., ltd. (20240128230). SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract

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SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Sinyeop Lee of Suwon-si (KR)

Taegyu Kang of Suwon-si (KR)

Jaeseon Hwang of Suwon-si (KR)

SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128230 titled 'SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Simplified Explanation

The patent application describes a soldering device and method that utilize a control unit to predict the final rise temperature of an electronic device during soldering, based on various parameters such as power of a light pulse, weight of the electronic device, real-time temperature, quantity of exposures of the light pulse, and irradiation period. The condition of the light pulse is then adjusted based on the predicted result.

  • Control unit predicts final rise temperature of electronic device during soldering
  • Parameters considered include power of light pulse, weight of electronic device, real-time temperature, quantity of exposures of light pulse, and irradiation period
  • Condition of light pulse is adjusted based on predicted result

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      1. Potential Applications
  • Soldering electronic components in manufacturing processes
  • Repairing electronic devices with precision and accuracy
      1. Problems Solved
  • Ensuring proper soldering without damaging electronic components
  • Predicting final rise temperature to prevent overheating
      1. Benefits
  • Improved soldering accuracy and efficiency
  • Prevents damage to electronic devices during soldering process
      1. Potential Commercial Applications
        1. Precision Soldering in Electronics Manufacturing
  • Optimizing soldering processes in electronics manufacturing
  • Enhancing quality control in electronic assembly lines
      1. Possible Prior Art

No prior art is known at this time.

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        1. Unanswered Questions
      1. How does the control unit adjust the condition of the light pulse based on the predicted result?

The abstract does not provide specific details on the mechanism or algorithm used by the control unit to adjust the condition of the light pulse.

      1. What is the expected accuracy of the predicted final rise temperature compared to actual measurements?

The abstract does not mention the expected margin of error or accuracy of the predicted final rise temperature compared to the actual temperature rise during soldering.


Original Abstract Submitted

a soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temperature of the electronic device, the quantity of exposures of the light pulse, and an irradiation period of the light pulse, and change a condition of the light pulse, based on a predicted result. a soldering method includes calculating power of the light pulse based on a time width of the light pulse, measuring a temperature of the electronic device, and predicting a final rise temperature of the electronic device, based on the calculated power, a weight of the electronic device, the measured temperature, the quantity of exposures of the light pulse, and the irradiation period.