International business machines corporation (20240120271). SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract
Contents
- 1 SKIP VIA WITH LATERAL LINE CONNECTION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SKIP VIA WITH LATERAL LINE CONNECTION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SKIP VIA WITH LATERAL LINE CONNECTION
Organization Name
international business machines corporation
Inventor(s)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
Koichi Motoyama of Clifton Park NY (US)
Ruilong Xie of Niskayuna NY (US)
Lawrence A. Clevenger of Saratoga Springs NY (US)
SKIP VIA WITH LATERAL LINE CONNECTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240120271 titled 'SKIP VIA WITH LATERAL LINE CONNECTION
Simplified Explanation
The semiconductor structure described in the abstract includes multiple levels of interconnect wiring and a skip via that extends from the third level to the first level of interconnect wiring, maintaining electrical contact with the second level. The contact area between the skip via and the second level of interconnect wiring is greater than the contact area between the bottom portion of the skip via and the top portion of the first level of interconnect wiring.
- The semiconductor structure includes multiple levels of interconnect wiring.
- A skip via extends from the third level to the first level of interconnect wiring.
- The skip via maintains electrical contact with the second level of interconnect wiring.
- The contact area between the skip via and the second level of interconnect wiring is greater than the contact area between the skip via and the first level of interconnect wiring.
Potential Applications
This technology could be used in:
- Advanced semiconductor devices
- High-performance computing systems
- Integrated circuits
Problems Solved
This technology helps to:
- Improve signal transmission efficiency
- Increase circuit density
- Enhance overall performance of semiconductor structures
Benefits
The benefits of this technology include:
- Enhanced electrical connectivity
- Improved reliability
- Higher integration levels
Potential Commercial Applications
This technology has potential applications in:
- Semiconductor manufacturing industry
- Electronics industry
- Telecommunications industry
Possible Prior Art
There may be prior art related to:
- Multi-level interconnect structures in semiconductor devices
- Skip vias for interconnect wiring in integrated circuits
Unanswered Questions
How does this technology impact power consumption in semiconductor devices?
The abstract does not provide information on the power consumption implications of this technology. Further research is needed to understand its effects on power efficiency.
What are the potential challenges in implementing this technology on a large scale?
The abstract does not address the challenges that may arise when scaling up the production of semiconductor structures with this technology. Additional studies are required to identify and overcome any obstacles in large-scale implementation.
Original Abstract Submitted
a semiconductor structure is presented including a first level of interconnect wiring, a second level of interconnect wiring disposed above the first level of interconnect wiring, a third level of interconnect wiring disposed above the second level of interconnect wiring, and a skip via extending from the third level of interconnect wiring to the first level of interconnect wiring such that a sidewall of the skip via maintains electrical contact with the second level of interconnect wiring. a contact area between the sidewall of the skip via and the second level of interconnect wiring is greater than a contact area between a bottom portion of the skip via and a top portion of the first level of interconnect wiring.