Taiwan semiconductor manufacturing company, ltd. (20240105701). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Chih-Wei Wu of Yilan County (TW)
Ying-Ching Shih of Hsinchu City (TW)
Wen-Chih Chiou of Miaoli County (TW)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105701 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The abstract describes a package structure and methods for forming the package structure, which includes a package component, an encapsulant, and a redistribution structure. The package component consists of a substrate with a protection structure made of organic material on one surface, and a multi-layered structure encapsulated by the protection structure.
- The package structure includes a package component, an encapsulant, and a redistribution structure.
- The package component comprises a substrate with a protection structure made of organic material on one surface.
- The protection structure surrounds the multi-layered structure within the package component.
- The multi-layered structure is separated from the encapsulant by the protection structure.
Potential Applications
This technology could be applied in:
- Electronic packaging
- Semiconductor devices
- Microelectronics
Problems Solved
This technology helps to:
- Protect sensitive components from external factors
- Improve the reliability and durability of electronic devices
Benefits
The benefits of this technology include:
- Enhanced protection for package components
- Increased reliability of electronic devices
- Improved performance of semiconductor devices
Potential Commercial Applications
Optimizing Package Structure for Electronic Devices
Possible Prior Art
There may be prior art related to:
- Encapsulation techniques in electronic packaging
- Protection structures for semiconductor devices
Unanswered Questions
How does this package structure compare to existing packaging solutions in terms of cost-effectiveness?
Answer: The article does not provide a direct comparison with existing packaging solutions in terms of cost-effectiveness.
What are the specific materials used in the protection structure and how do they contribute to the overall performance of the package structure?
Answer: The article does not detail the specific materials used in the protection structure and their impact on the package structure's performance.
Original Abstract Submitted
a package structure and methods for forming the package structure are provided. the package structure includes a package component, an encapsulant disposed around the package component, and a redistribution structure disposed over the package component and the encapsulant. the package component includes a substrate, a protection structure, which includes an organic material, over a first surface of the substrate, and a multi-layered structure encapsulated by the protection structure. sidewalls of the multi-layered structure are spaced apart from the encapsulant by the protection structure.
