18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
- 1 PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chun-Ti Lu of Hsinchu County (TW)
Hao-Yi Tsai of Hsinchu City (TW)
Chia-Hung Liu of Hsinchu City (TW)
Yu-Hsiang Hu of Hsinchu City (TW)
Hsiu-Jen Lin of Hsinchu County (TW)
Tzuan-Horng Liu of Taoyuan City (TW)
Chih-Hao Chang of Hsinchu County (TW)
Bo-Jiun Lin of Hsinchu City (TW)
Shih-Wei Chen of Hsinchu County (TW)
Hung-Chun Cho of Hsinchu City (TW)
Pei-Rong Ni of Chiayi County (TW)
Hsin-Wei Huang of Hsinchu County (TW)
Zheng-Gang Tsai of Hsinchu (TW)
Tai-You Liu of Hsinchu City (TW)
Po-Chang Shih of Taichung City (TW)
Yu-Ting Huang of Hsinchu City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18186209 titled 'PACKAGE STRUCTURE
Simplified Explanation
The abstract describes a package structure for an electronic device, which includes a semiconductor die, a redistribution circuit structure, and an insulating encapsulation. The redistribution circuit structure consists of a colored dielectric layer, inter-dielectric layers, and redistribution conductive layers embedded within the inter-dielectric layers. The electronic device is connected to the redistribution circuit structure.
- The package structure includes a semiconductor die, an insulating encapsulation, and a redistribution circuit structure.
- The redistribution circuit structure comprises a colored dielectric layer, inter-dielectric layers, and redistribution conductive layers.
- The electronic device is connected to the redistribution circuit structure.
Potential Applications
This technology could be applied in:
- Consumer electronics
- Automotive electronics
- Medical devices
Problems Solved
This technology helps in:
- Enhancing the reliability of electronic devices
- Improving the performance of semiconductor dies
- Providing better protection for the semiconductor die
Benefits
The benefits of this technology include:
- Increased durability of electronic devices
- Enhanced electrical connectivity
- Improved overall functionality of the electronic device
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor manufacturing companies
- Electronics assembly companies
- Research and development organizations
Possible Prior Art
One possible prior art could be the use of redistribution layers in semiconductor packaging to improve electrical connectivity and performance.
Unanswered Questions
How does the colored dielectric layer impact the overall performance of the electronic device?
The colored dielectric layer may have specific properties that could affect the functionality of the device, but this aspect is not elaborated on in the abstract.
What specific materials are used in the inter-dielectric layers?
The abstract mentions inter-dielectric layers, but the materials used in these layers are not specified.
Original Abstract Submitted
A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Ti Lu of Hsinchu County (TW)
- Hao-Yi Tsai of Hsinchu City (TW)
- Chia-Hung Liu of Hsinchu City (TW)
- Yu-Hsiang Hu of Hsinchu City (TW)
- Hsiu-Jen Lin of Hsinchu County (TW)
- Tzuan-Horng Liu of Taoyuan City (TW)
- Chih-Hao Chang of Hsinchu County (TW)
- Bo-Jiun Lin of Hsinchu City (TW)
- Shih-Wei Chen of Hsinchu County (TW)
- Hung-Chun Cho of Hsinchu City (TW)
- Pei-Rong Ni of Chiayi County (TW)
- Hsin-Wei Huang of Hsinchu County (TW)
- Zheng-Gang Tsai of Hsinchu (TW)
- Tai-You Liu of Hsinchu City (TW)
- Po-Chang Shih of Taichung City (TW)
- Yu-Ting Huang of Hsinchu City (TW)
- H01L23/498
- H01L21/48
- H01L21/56
- H01L23/00
- H01L23/31
- H01L23/538
- H10B80/00