18243437. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Youngdeuk Kim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18243437 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a heat dissipation member with a heat dissipation plate and a seed metal layer, as well as a metal thermal interfacial material (TIM) on the seed metal layer.
- The semiconductor package includes a first substrate and a first chip structure with at least one chip.
- A heat dissipation member is placed on the first chip structure, consisting of a heat dissipation plate with a seed metal layer.
- The seed metal layer is located on the second surface of the heat dissipation plate.
- A metal thermal interfacial material (TIM) is applied on the seed metal layer.
Potential Applications
- This technology can be used in electronic devices such as computers, smartphones, and servers to improve heat dissipation and thermal management.
- It can also be applied in automotive electronics to enhance the performance and reliability of semiconductor components.
Problems Solved
- Improves heat dissipation efficiency, reducing the risk of overheating and potential damage to semiconductor devices.
- Enhances the overall performance and longevity of electronic devices by maintaining optimal operating temperatures.
Benefits
- Increased reliability and durability of semiconductor components.
- Improved thermal management leading to better overall performance of electronic devices.
- Enhanced safety by preventing overheating issues that could potentially cause malfunctions or failures.
Original Abstract Submitted
Provided is a semiconductor package including a first substrate, a first chip structure on the first substrate, the first chip structure including at least one chip, a heat dissipation member on the first chip structure, the heat dissipation member including a heat dissipation plate including a first surface facing the first chip structure and a second surface opposite to the first surface and a seed metal layer on the second surface of the heat dissipation plate, and a metal thermal interfacial material (TIM) on the seed metal layer.