17895502. PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

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PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Wen-Shiang Liao of Toufen Township (TW)

PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION - A simplified explanation of the abstract

This abstract first appeared for US patent application 17895502 titled 'PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION

Simplified Explanation

  • Device and method for integrating a receive transmit integrated circuit die and embedded antenna
  • Oscillation region aligned to embedded antenna with a cavity in the substrate for RF signal passage
  • Simplified explanation: A device and method for integrating a circuit die and antenna with a cavity for RF signal passage

Potential Applications

  • Wireless communication devices
  • Internet of Things (IoT) devices
  • RFID technology

Problems Solved

  • Integration of circuit die and antenna
  • Efficient RF signal transmission and reception

Benefits

  • Compact design
  • Improved signal quality
  • Cost-effective solution


Original Abstract Submitted

Embodiments provide an integrated package device and method of forming the same, the device including a receive transmit integrated circuit die and embedded antenna. An oscillation region is aligned to the embedded antenna and a cavity is provided in the substrate to allow the passage of radio frequency (RF) signals into and out of the oscillation region.

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