18503453. System, Device and Methods of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
System, Device and Methods of Manufacture
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wei Ling Chang of Hsinchu (TW)
Chuei-Tang Wang of Taichung City (TW)
Che-Wei Hsu of Kaohsiung City (TW)
System, Device and Methods of Manufacture - A simplified explanation of the abstract
This abstract first appeared for US patent application 18503453 titled 'System, Device and Methods of Manufacture
Simplified Explanation
- Systems, devices, and methods for manufacturing a system on silicon wafer (SoSW) device and package are described. - Functional dies are formed in a silicon wafer using different sets of masks. - A first redistribution structure is formed over the silicon wafer to provide local interconnects between adjacent dies of the same type or different types. - A second redistribution structure may be formed over the first redistribution layer to provide semi-global and/or global interconnects between non-adjacent dies of the same type or different types. - An optional backside redistribution structure may be formed on the second side of the silicon wafer to provide backside interconnects between functional dies of different types.
Potential Applications
- Semiconductor manufacturing - Integrated circuit packaging - Electronic device manufacturing
Problems Solved
- Efficient interconnectivity between functional dies on a silicon wafer - Simplified manufacturing process for system on silicon wafer devices - Improved functionality and performance of integrated circuits
Benefits
- Increased efficiency in manufacturing processes - Enhanced interconnectivity between different types of functional dies - Improved performance and functionality of system on silicon wafer devices
Original Abstract Submitted
Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types.
