17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chih-Wen Liu of Taoyuan City (TW)

Yeo-Sin Lin of Taichung City (TW)

Shu-Wei Hsu of Taipei City (TW)

Che-Hao Tu of Hsinchu City (TW)

Hui-Chi Huang of Zhubei City (TW)

Kei-Wei Chen of Tainan City (TW)

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM - A simplified explanation of the abstract

This abstract first appeared for US patent application 17887718 titled 'ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

Simplified Explanation

The patent application describes a process tool for polishing wafers using an abrasive slurry and charged abrasive particles.

• Polishing pad on top surface of wafer platen
• Wafer carrier holds wafer over polishing pad
• Slurry dispenser dispenses abrasive slurry with charged abrasive particles onto pad
• First conductive rod in wafer platen connected to first voltage supply
• Wafer roller supports wafer
• First wafer brush beside wafer roller
• Second conductive rod in first wafer brush connected to second voltage supply
• First voltage supply applies charge with second polarity to first conductive rod
• Second voltage supply applies charge with second polarity to second conductive rod

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1. 1. 1. Potential Applications

• Semiconductor manufacturing
• Microelectronics industry
• Wafer polishing processes

1. 1. 1. Problems Solved

• Efficient and precise wafer polishing
• Control of abrasive particles during polishing
• Reduction of defects on wafers

1. 1. 1. Benefits

• Improved polishing uniformity
• Enhanced control over polishing process
• Increased productivity in wafer manufacturing

Original Abstract Submitted

A process tool including a polishing pad on a top surface of a wafer platen. A wafer carrier is configured to hold a wafer over the polishing pad. A slurry dispenser is configured to dispense an abrasive slurry including a plurality of charged abrasive particles having a first polarity onto the polishing pad. A first conductive rod is within the wafer platen and coupled to a first voltage supply. A wafer roller is configured to support the wafer. A first wafer brush is arranged beside the wafer roller. A second conductive rod is within the first wafer brush and coupled to a second voltage supply. The first voltage supply is configured to apply a first charge having a second polarity, opposite the first polarity, to the first conductive rod. The second voltage supply is configured to apply a second charge having the second polarity to the second conductive rod.