20240047223. SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Organization Name

Tokyo Electron Limited

Inventor(s)

Sho Kumakura of Kurokawa-gun (JP)

Kenta Ono of Kurokawa-gun (JP)

Shinya Ishikawa of Kurokawa-gun (JP)

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047223 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Simplified Explanation

The present disclosure is about a substrate processing method that involves providing a substrate in a chamber. The substrate has an etching target film and a tin-containing film, where the tin-containing film defines at least one opening on the etching target film. The method further includes forming a modified film by supplying a processing gas to the chamber, which forms the modified film on the surface of the tin-containing film. The processing gas used can be a halogen-containing gas or an oxygen-containing gas.

• The method involves providing a substrate with an etching target film and a tin-containing film.
• The tin-containing film has at least one opening on the etching target film.
• A processing gas is supplied to the chamber to form a modified film on the surface of the tin-containing film.
• The processing gas can be a halogen-containing gas or an oxygen-containing gas.

Potential applications of this technology:

• Semiconductor manufacturing: This method can be used in the fabrication of semiconductor devices where precise etching and modification of films are required.
• Thin film deposition: The modified film formed using this method can serve as a protective layer or enhance the properties of the underlying films, making it useful in various thin film deposition processes.

Problems solved by this technology:

• Selective modification: The method allows for selective modification of the tin-containing film without affecting the etching target film, enabling precise control over the modification process.
• Enhanced film properties: The modified film can improve the properties of the underlying films, such as adhesion, conductivity, or optical properties, leading to improved device performance.

Benefits of this technology:

• Selective and controlled modification: The method provides a means to selectively modify specific areas of the substrate, allowing for precise control over the modification process.
• Improved film properties: The modified film can enhance the properties of the underlying films, leading to improved device performance and reliability.
• Compatibility with different gases: The method can utilize either halogen-containing gases or oxygen-containing gases, providing flexibility in the choice of processing gas based on specific requirements.

Original Abstract Submitted

a substrate processing method according to the present disclosure includes: providing a substrate in a chamber, the substrate having an etching target film and a tin-containing film, the tin-containing film defining at least one opening on the etching target film; and forming a modified film by supplying a processing gas to the chamber to form the modified film on a surface of the tin-containing film, the processing gas including a halogen-containing gas or an oxygen-containing gas.