17644431. Integrated Attenuator with Thermal Vias simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

Integrated Attenuator with Thermal Vias

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Young Kwark of Chappaqua NY (US)

Integrated Attenuator with Thermal Vias - A simplified explanation of the abstract

This abstract first appeared for US patent application 17644431 titled 'Integrated Attenuator with Thermal Vias

Simplified Explanation

The abstract describes an attenuator, which is a device used to reduce the amplitude of a signal. This attenuator includes several layers and components that help manage and dissipate heat generated by a resistor.

• The attenuator consists of a first thermal reservoir and a first metal layer on top of it.
• On top of the first metal layer, there is a first dielectric layer.
• A resistor is placed on top of the first dielectric layer.
• A second dielectric layer is located on top of the resistor.
• A second metal layer is placed on top of the second dielectric layer.
• A second thermal reservoir is located on top of the third metal layer.
• The resistor is split or perforated by a thermal shunt, which includes a thermal column.
• The thermal column directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.

Potential Applications

• Signal attenuation in electronic devices.
• Heat management in high-power circuits.
• Thermal dissipation in electronic components.

Problems Solved

• Efficient heat dissipation in attenuators.
• Prevention of overheating in electronic devices.
• Improved performance and longevity of electronic components.

Benefits

• Enhanced heat management capabilities.
• Increased reliability and durability of electronic devices.
• Improved performance of attenuators and electronic circuits.

Original Abstract Submitted

An attenuator comprising a first thermal reservoir and a first metal layer located on top of the first thermal reservoir. A first dielectric layer located on top of the first metal layer and a resistor located on top the first dielectric layer. A second dielectric layer located on top of the resistor and a second metal layer located on top of the second dielectric layer. A second thermal reservoir located on top the third metal layer and wherein the resistor is split or perforated by a thermal shunt, wherein the thermal shunt includes a thermal column that directs the heat generated by the resistor vertically upwards or downwards into the first and second thermal reservoirs, respectively.