US Patent Application 18335387. RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE simplified abstract

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RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE

Inventors

Katsuhiro Yamamoto of Yokohama (JP)


RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE - A simplified explanation of the abstract

  • This abstract for appeared for patent application number 18335387 Titled 'RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE'

Simplified Explanation

The abstract describes a resin composition that has specific viscosity and storage modulus properties at different temperatures. The viscosity of the resin is equal to or less than 20 mPa·s at a temperature between 30°C and 50°C. The storage modulus of the resin is between 1.7×10Pa and 3×10Pa at -20°C, and between 1.5×10Pa and 6×10Pa at 25°C. The abstract also mentions the provision of an adhesive member made from this resin composition.


Original Abstract Submitted

A resin composition has a viscosity of equal to or less than about 20 mPa·s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×10Pa to about 3×10Pa at about −20° C., and a storage modulus in a range of about 1.5×10Pa to about 6×10Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

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