17943299. LIGHT EMITTING DIODE PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
LIGHT EMITTING DIODE PACKAGE
Organization Name
Inventor(s)
Jaehyuk Lim of Hwaseong-si (KR)
Hyojeong Kang of Hwaseong-si (KR)
LIGHT EMITTING DIODE PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17943299 titled 'LIGHT EMITTING DIODE PACKAGE
Simplified Explanation
The abstract describes a patent application for a light-emitting diode (LED) package that includes various components such as a substrate, upper pads, a side surface molding layer, an LED chip, a fluorescent layer, and a reflection molding layer.
- The LED package includes a substrate made of an insulating material.
- There are upper pads on the upper surface of the substrate.
- A side surface molding layer covers the upper surface of the substrate and the side surfaces of the upper pads.
- An LED chip is placed on the upper surface of the substrate and is electrically connected to the upper pads.
- A fluorescent layer is present on the LED chip.
- A reflection molding layer, made of white silicon, covers the substrate and the LED chip, exposing a portion of the side surfaces of the fluorescent layer.
Potential Applications:
- Lighting applications, such as LED bulbs and fixtures.
- Display applications, such as LED screens and signage.
- Automotive lighting, including headlights and taillights.
- Backlighting for LCD screens in televisions, monitors, and mobile devices.
Problems Solved:
- The LED package provides improved light reflection and emission efficiency.
- The reflection molding layer helps to enhance the brightness and color rendering of the LED chip.
- The exposed side surfaces of the fluorescent layer allow for better light diffusion and distribution.
Benefits:
- Increased overall efficiency and brightness of the LED package.
- Improved color rendering and light quality.
- Enhanced light diffusion and distribution.
- Potential for energy savings and longer lifespan compared to traditional lighting technologies.
Original Abstract Submitted
A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.
