17879106. REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

HYEONJEONG Hwang of Cheonan-si (KR)

DONGKYU Kim of Anyang-si (KR)

KYOUNG LIM Suk of Suwon-si (KR)

WONJAE Lee of Yongin-si (KR)

REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17879106 titled 'REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Simplified Explanation

The abstract describes a redistribution substrate for electronic devices. The substrate includes multiple layers with different patterns to facilitate interconnections between components.

• The first interconnection layer has a first insulating pattern, along with two dummy patterns (dot patterns and a plate pattern) within it.
• The second interconnection layer is stacked on top of the first layer and has a second insulating pattern, along with a signal pattern and a power/ground pattern within it.
• The first dummy pattern is positioned below the signal pattern, while the second dummy pattern is positioned below the power/ground pattern.

Potential applications of this technology:

• Electronic devices and systems that require efficient interconnections between components.
• Integrated circuits, microprocessors, and other electronic components that need redistribution substrates for signal and power/ground connections.

Problems solved by this technology:

• Provides a simplified and efficient method for interconnecting components in electronic devices.
• Helps to reduce signal interference and improve overall performance.

Benefits of this technology:

• Improved signal integrity and reduced noise interference.
• Enhanced performance and reliability of electronic devices.
• Simplified manufacturing process for redistribution substrates.

Original Abstract Submitted

A redistribution substrate may include a first interconnection layer having a first insulating pattern, a first dummy pattern and a second dummy pattern, the first and second dummy patterns being in the first insulating pattern, and a second interconnection layer stacked on the first interconnection layer, the second interconnection layer having a second insulating pattern, a signal pattern and a power/ground pattern, the signal and power/ground patterns being in the second insulating pattern. The first dummy pattern may be located below the signal pattern, and the second dummy pattern may be located below the power/ground pattern. The first dummy pattern may include dot patterns, and the second dummy pattern may include a plate pattern.