17715782. SUBSTRATE TRANSFER DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

SUBSTRATE TRANSFER DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sanglyong Shin of Cheonan-Si (KR)

SUBSTRATE TRANSFER DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17715782 titled 'SUBSTRATE TRANSFER DEVICE

Simplified Explanation

The disclosed semiconductor transfer device is designed to securely hold a substrate within a housing during transfer processes. The device includes a lower support that extends onto the bottom surface of the substrate and an upper support with a second hold member that contacts the top surface of the substrate. An extension part protrudes onto the outer surface of the housing.

• The device has a housing with an opening for substrate introduction.
• A substrate hold structure fixes the substrate in the housing.
• The lower support extends onto the bottom surface of the substrate.
• The upper support extends towards the side of the substrate and includes a second hold member.
• The second hold member moves onto the substrate, overlapping the first hold member.
• An extension part penetrates the housing and protrudes onto the outer surface.

Potential Applications

• Semiconductor manufacturing processes
• Transfer of delicate substrates in various industries

Problems Solved

• Ensures secure and stable holding of substrates during transfer
• Prevents damage or misalignment of substrates

Benefits

• Improved efficiency and accuracy in substrate transfer
• Reduces the risk of substrate damage or loss during transfer

Original Abstract Submitted

Disclosed is a semiconductor transfer device comprising a housing having a surface that has an opening through which a substrate is introduced, and a substrate hold structure that fixes the substrate in the housing. The substrate hold structure includes a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, and an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing and includes a second hold member. An operation of the upper support causes the second hold member to move onto the substrate such that the second hold member contacts a top surface of the substrate and overlaps the first hold member. An extension part penetrates the housing and protrudes onto an outer surface of the housing.