17677702. SEMICONDUCTOR DIE DIPPING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
SEMICONDUCTOR DIE DIPPING STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chi-Chun Peng of Hsinchu City (TW)
Chih-Yuan Chiu of Zhudong Township (TW)
Min-Yu Wu of Hsinchu City (TW)
Yi-Kai Tu of Hsinchu City (TW)
Cheng-Lung Wu of Zhunan Township (TW)
SEMICONDUCTOR DIE DIPPING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17677702 titled 'SEMICONDUCTOR DIE DIPPING STRUCTURE
Simplified Explanation
The abstract describes a die dipping structure that includes a plate with two recessed portions filled with different flux materials. The plate can be moved by a motor to simultaneously dip two dies into the respective flux materials.
- The die dipping structure includes a plate with two recessed portions filled with different flux materials.
- The first recessed portion has a different depth than the second recessed portion.
- A motor is used to move the plate and dip two dies simultaneously into the flux materials.
- The innovation allows for the simultaneous dipping of multiple dies into different flux materials.
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
- Integrated circuit testing
Problems Solved
- Efficient and simultaneous dipping of multiple dies into different flux materials
- Improved manufacturing process for semiconductor and electronic components
Benefits
- Time-saving and efficient process
- Enhanced productivity in die dipping operations
- Improved quality control and testing capabilities
Original Abstract Submitted
A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.
