18464258. COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM simplified abstract (FUJIFILM Corporation)
Contents
COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM
Organization Name
Inventor(s)
Yuta Watanabe of Saitama-shi (JP)
Yoshihiro Hayashi of Saitama-shi (JP)
Nobuaki Suzuki of Saitama-shi (JP)
Kouhei Awazu of Saitama-shi (JP)
COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18464258 titled 'COOLING DEVICE AND ELECTRONIC APPARATUS SYSTEM
Simplified Explanation
The abstract describes a cooling device for electronic apparatus that includes a heat sink with fins for heat radiation and an attachment mechanism for attaching the heat sink to the outer surface of the apparatus. The attachment mechanism overlaps with the fins.
- The cooling device includes a heat sink with fins for heat radiation.
- An attachment mechanism is provided to attach the heat sink to the outer surface of an electronic apparatus.
- The attachment mechanism overlaps with the fins of the heat sink.
Potential Applications
- Cooling electronic devices such as computers, laptops, servers, or gaming consoles.
- Cooling power electronics, such as inverters or motor drives.
- Cooling LED lighting systems or other heat-generating components in various industries.
Problems Solved
- Overheating of electronic devices due to insufficient cooling systems.
- Difficulty in attaching and detaching heat sinks securely to electronic apparatus.
- Limited space for heat sink attachment due to the presence of other components.
Benefits
- Efficient heat dissipation to prevent overheating and improve device performance.
- Secure attachment mechanism ensures stability and reliability.
- Overlapping attachment mechanism allows for better utilization of limited space.
Original Abstract Submitted
There is provided a cooling device including: a heat sink on which a plurality of fins for heat radiation are formed; and an attachment mechanism for attachably and detachably attaching the heat sink to an outer surface of an electronic apparatus, at least a part of the attachment mechanism overlapping a formation region of the fins.
