17809128. Cooling Cover and Packaged Semiconductor Device Including the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Cooling Cover and Packaged Semiconductor Device Including the Same
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sheng-Tsung Hsiao of Taoyuan City (TW)
Tung-Liang Shao of Hsinchu (TW)
Chih-Hang Tung of Hsinchu (TW)
Cooling Cover and Packaged Semiconductor Device Including the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 17809128 titled 'Cooling Cover and Packaged Semiconductor Device Including the Same
Simplified Explanation
The abstract describes a patent application for cooling covers with trapezoidal cooling chambers for semiconductor devices. The cooling cover includes an inlet, an outlet, and a cooling chamber that has a trapezoidal shape in a cross-sectional view.
- The patent application is for cooling covers designed specifically for packaged semiconductor devices.
- The cooling cover includes an inlet and an outlet to allow for the flow of cooling fluid.
- The cooling chamber within the cover is in fluid communication with the inlet and the outlet.
- The cooling chamber is designed with a trapezoidal shape in a cross-sectional view.
- The trapezoidal shape of the cooling chamber is likely to optimize the cooling efficiency for the semiconductor device.
Potential Applications
- Cooling covers with trapezoidal cooling chambers can be used in various semiconductor devices, such as microprocessors, memory chips, and power electronics.
- This technology can be applied in industries that heavily rely on semiconductor devices, including consumer electronics, automotive, aerospace, and telecommunications.
Problems Solved
- Overheating is a common issue in semiconductor devices, which can lead to reduced performance and even failure.
- Traditional cooling methods may not be efficient enough to adequately cool semiconductor devices.
- The trapezoidal cooling chambers in the cooling covers aim to solve the problem of inefficient cooling by optimizing the flow of cooling fluid.
Benefits
- The trapezoidal shape of the cooling chamber is expected to enhance the cooling efficiency of the semiconductor device.
- Improved cooling can help prevent overheating, prolong the lifespan of the semiconductor device, and maintain optimal performance.
- The cooling covers can be easily integrated into existing semiconductor device designs, providing a cost-effective cooling solution.
Original Abstract Submitted
Cooling covers including trapezoidal cooling chambers for cooling packaged semiconductor devices and methods of forming the same are disclosed. In an embodiment, a cooling cover for a semiconductor device includes an inlet; an outlet; and a cooling chamber in fluid communication with the inlet and the outlet, the cooling chamber having a trapezoidal shape in a cross-sectional view.
