17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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Polishing Pad for Chemical Mechanical Polishing and Method

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Te-Chien Hou of Kaohsiung City (TW)

Chih Hung Chen of Hsinchu (TW)

Liang-Che Chen of Hsinchu (TW)

Shich-Chang Suen of Hsinchu (TW)

Liang-Guang Chen of Hsinchu (TW)

Polishing Pad for Chemical Mechanical Polishing and Method - A simplified explanation of the abstract

This abstract first appeared for US patent application 17822867 titled 'Polishing Pad for Chemical Mechanical Polishing and Method

Simplified Explanation

The abstract describes a patent application for polishing pads with varying protrusions and methods of making them. The polishing pad includes a substrate, a first protrusion with a central region and a peripheral region, and a first groove adjacent to the first side of the first protrusion.

  • The patent application is for polishing pads with varying protrusions.
  • The polishing pad includes a substrate, which serves as the base for the pad.
  • The pad has a first protrusion with a central region and a peripheral region.
  • The central region of the protrusion has a higher hardness than the peripheral region.
  • The pad also has a first groove adjacent to one side of the first protrusion.

Potential applications of this technology:

  • Polishing and finishing surfaces in various industries such as automotive, electronics, and optics.
  • Removing scratches, imperfections, or blemishes from surfaces.
  • Achieving a smooth and polished finish on different materials like metal, glass, or plastic.

Problems solved by this technology:

  • Uneven polishing or finishing of surfaces due to the uniform hardness of traditional polishing pads.
  • Inefficient removal of scratches or imperfections on surfaces.
  • Lack of control over the polishing process, resulting in inconsistent results.

Benefits of this technology:

  • Improved polishing efficiency and effectiveness.
  • Enhanced control over the polishing process for achieving desired results.
  • Reduced time and effort required for surface polishing.
  • Consistent and uniform finish on various materials.


Original Abstract Submitted

Polishing pads having varying protrusions and methods of forming the same are disclosed. In an embodiment, a polishing pad includes a polishing pad substrate; a first protrusion on the polishing pad substrate, the first protrusion including a central region and a peripheral region surrounding the central region, and a first hardness of the central region being greater than a second hardness of the peripheral region; and a first groove adjacent a first side of the first protrusion.

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