18174992. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

CHOONGBIN Yim of Suwon-si (KR)

JI-YONG Park of Suwon-si (KR)

JIN-WOO Park of Suwon-si (KR)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18174992 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation

The abstract describes a semiconductor package that includes a package substrate, substrate pads, core balls, a redistribution substrate, and a semiconductor chip. The core balls are larger in diameter than the solder balls used for electrical connections.

• The semiconductor package includes a package substrate.
• Substrate pads are provided on the top surface of the package substrate.
• At least one core ball is placed on one of the substrate pads.
• A redistribution substrate is placed on top of the package substrate.
• A semiconductor chip is mounted on the redistribution substrate.
• The redistribution substrate is electrically connected to the package substrate through solder balls on its bottom surface.
• The core ball is electrically connected to the redistribution substrate.
• The diameter of the core ball is larger than the diameter of the solder balls.

Potential Applications

• This technology can be used in various semiconductor devices and electronic systems.
• It can be applied in the manufacturing of integrated circuits and microprocessors.

Problems Solved

• The use of larger core balls provides improved electrical connections and reliability.
• It helps to enhance the performance and functionality of semiconductor packages.

Benefits

• The larger core balls offer better electrical conductivity and stability.
• The technology improves the overall performance and reliability of semiconductor packages.
• It allows for more efficient and effective integration of semiconductor chips.

Original Abstract Submitted

A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.