Information for "US Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract"

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Display titleUS Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract
Default sort keyUS Patent Application 18346321. MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) simplified abstract
Page length (in bytes)1,734
Page ID3818
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Page creatorWikipatents (talk | contribs)
Date of page creation04:06, 1 November 2023
Latest editorWikipatents (talk | contribs)
Date of latest edit04:06, 1 November 2023
Total number of edits1
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