Information for "17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)"
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Display title | 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC) |
Default sort key | 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC) |
Page length (in bytes) | 3,954 |
Page ID | 26425 |
Page content language | en - English |
Page content model | wikitext |
Indexing by robots | Allowed |
Number of redirects to this page | 0 |
Counted as a content page | Yes |
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Edit history
Page creator | Wikipatents (talk | contribs) |
Date of page creation | 07:05, 2 February 2024 |
Latest editor | Wikipatents (talk | contribs) |
Date of latest edit | 07:05, 2 February 2024 |
Total number of edits | 1 |
Total number of distinct authors | 1 |
Recent number of edits (within past 90 days) | 0 |
Recent number of distinct authors | 0 |