View source for US Patent Application 17896249. Thermo-Electric Cooler for Dissipating Heat of Optical Engine simplified abstract

=Thermo-Electric Cooler for Dissipating Heat of Optical Engine=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Hsing-Kuo Hsia of Jhubei City (TW)|Hsing-Kuo Hsia of Jhubei City (TW)]][[Category:Hsing-Kuo Hsia of Jhubei City (TW)]]

[[:Category:Chih-Kuang Yu of Chiayi City (TW)|Chih-Kuang Yu of Chiayi City (TW)]][[Category:Chih-Kuang Yu of Chiayi City (TW)]]

[[:Category:Chen-Hua Yu of Hsinchu (TW)|Chen-Hua Yu of Hsinchu (TW)]][[Category:Chen-Hua Yu of Hsinchu (TW)]]

[[:Category:Jui Lin Chao of New Taipei City (TW)|Jui Lin Chao of New Taipei City (TW)]][[Category:Jui Lin Chao of New Taipei City (TW)]]

==Thermo-Electric Cooler for Dissipating Heat of Optical Engine - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17896249 titled 'Thermo-Electric Cooler for Dissipating Heat of Optical Engine

==Simplified Explanation==

The patent application describes a method for assembling a device that includes a photonic engine and a package component.
* The photonic engine is bonded onto an interposer, which is a substrate that provides electrical connections.
* The package component, which includes a device die, is then bonded onto the interposer.
* The package component and the photonic engine are encapsulated in a protective material.
* A thermal-electronic cooler is attached to the photonic engine to manage heat.
* A metal lid is attached to the package component for further protection.


==Original Abstract Submitted==

A method includes bonding a photonic engine onto an interposer, and bonding a package component onto the interposer. The package component includes a device die. The method further includes encapsulating the package component and the photonic engine in an encapsulant, attaching a thermal-electronic cooler to the photonic engine, and attaching a metal lid to the package component.



[[Category:G02B6/42]]