View source for US Patent Application 17749038. INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING simplified abstract

=INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Tz-Shian Chen of Hsinchu (TW)|Tz-Shian Chen of Hsinchu (TW)]][[Category:Tz-Shian Chen of Hsinchu (TW)]]

[[:Category:Li-Ting Wang of Hsinchu (TW)|Li-Ting Wang of Hsinchu (TW)]][[Category:Li-Ting Wang of Hsinchu (TW)]]

[[:Category:Yee-Chia Yeo of Hsinchu (TW)|Yee-Chia Yeo of Hsinchu (TW)]][[Category:Yee-Chia Yeo of Hsinchu (TW)]]

==INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17749038 titled 'INTEGRATED PHOTORESIST REMOVAL AND LASER ANNEALING

==Simplified Explanation==

The patent application describes a method for forming a semiconductor device.
* The method involves removing a light-sensitive material from a workpiece using polarized electromagnetic radiation.
* The workpiece is then annealed, or heated, using electromagnetic radiation polarized in a different direction than the one used for removing the light-sensitive material.
* In some cases, the electromagnetic radiation used for annealing is not polarized.
* The method also ensures that the removed light-sensitive material is exhausted from the chamber where the removal process takes place, preventing it from depositing on chamber surfaces.


==Original Abstract Submitted==

A method of forming a semiconductor device includes removing a light-sensitive material from a workpiece utilizing polarized electromagnetic radiation and annealing features on the workpiece utilizing electromagnetic radiation polarized in a different direction than the polarized electromagnetic radiation utilized to remove the light-sensitive material. In some embodiments, the electromagnetic radiation used to anneal the features on the workpiece is not polarized. In some described embodiments, light-sensitive material removed from the workpiece is exhausted from the chamber in which the light-sensitive removal process is carried out before it can deposit on surfaces of the chamber.



[[Category:H01L21/027]]